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PROTECTION PRODUCTS - EMIClampTM Description
The EClampTM2410P is a combination EMI filter and line termination device with integrated TVS diodes for use on Multimedia Card interfaces. This state-of-the-art device utilizes solid-state silicon-avalanche technology for superior clamping performance and DC electrical characteristics. They have been optimized for protection of T-Flash/MicroSD interfaces in cellular phones and other portable electronics. The device consists of six circuits that include series impedance matching resistors and pull up resistors as required by the SD specification. TVS diodes are included on each line for ESD protection. An additional TVS diode connection is included for protection of the voltage (Vdd) bus. Termination resistor value of 45 Ohms is included on the DAT0, DAT1, DAT2, DAT3, CMD, and CLK lines. Pull up resistors of 15k Ohms are included on DAT0, DAT1, DAT2, and CMD lines while a 50k Ohm pull up is inlcuded on the DAT3 line. These may be configured for devices operating in SD or SPI mode . The TVS diodes provide effective suppression of ESD voltages in excess of 15kV (air discharge) and 8kV (contact discharge) per IEC 61000-4-2, level 4. The ECLAMP2410P is in a 16-pin, RoHS/WEEE compliant, SLP4016P16 package. It measures 4.0 x 1.6 x 0.58mm. The leads are spaced at a pitch of 0.5mm and are finished with lead-free NiPd.
ESD Protection Device for T-Flash/MicroSD Interfaces
PRELIMINARY Features
Bidirectional EMI/RFI filtering and line termination with integrated ESD protection ESD protection to IEC 61000-4-2 (ESD) Level 4, 15kV (air), 8kV (contact) TVS working voltage: 5V Termination Resistors: 45 Pull Up Resistors: 15k (3 each) and 50k Typical Capacitance per Line: 12pF (VR = 2.5V) Protection and termination for six lines + Vdd Solid-state technology
ECLAMP2410P
Mechanical Characteristics
SLP4016P16 16-pin package RoHS/WEEE Compliant Nominal Dimensions: 4.0 x 1.6 x 0.58 mm Lead Pitch: 0.5mm Lead finish: NiPd Marking: Marking Code Packaging: Tape and Reel per EIA 481
Applications
T-Flash / MicroSD Interfaces MMC Interfaces CDMA, GSM, 3G Cell Phones
Pin Configuration
Package Configuration
4.00
12
D AT1 In D AT0 In C L K In R up1 Vd d C MD In D AT3 In D AT2 In
1
16
D AT1 O u t D AT0 O u t C LK Out R up3 R up2 C MD O u t D AT3 O u t D AT2 O u t
1.60
0.50 BSC
0.58
16 Pin SLP package (Bottom Side View) Nominal Dimensions in mm
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Pin Designation (Top View)
Revision 07/20/2006
ECLAMP2410P
PROTECTION PRODUCTS Pin Identification and Configuration
Pin
1, 16 2, 15 3, 14 4 5 6, 11 7, 10 8, 9 12 13 Center tab
PRELIMINARY
Symbol
DAT1 DAT0 Clock Rup1 Vdd CMD DAT3 DAT2 Rup2 Rup3 GND
Identification
Data line #1 input/output with pull-up resistor Data line #0 input/output with pull-up resistor Clock line Input/Output 15k Pull-up resistor from DAT1 & DAT2 Power Supply ESD Protection Command Line Input/Output Data line #3 input/output with pull-up resistor Data line #2 input/output with pull-up resistor 50k Pull-Up Resistor from DAT3 15k Pull-up resistor from DAT0 & CMD Ground connection
16 15 14 13 12 11 10 9
1
2345678
Pin Configuration (Top View)
Schematics & Component Values
Pin 4
Pin 12
Rup 15K Pin 1, 8 45 Ohms Pin 9, 16
Rup 50K Pin 7 45 Ohms Pin 10
DAT1, DAT2
DAT0, CMD Line
DAT3
Pin 13
Pin 3
45 Ohms
Pin 14
Pin 5
Rup 15K Pin 2, 6 45 Ohms Pin 11, 15
CLK
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Vdd
2
DAT0, CMD
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ECLAMP2410P
PROTECTION PRODUCTS Maximum Ratings
Rating ESD per IEC61000-4-2 (Air) ESD per IEC61000-4-2 (Contact) Operating Temperature Storage Temperature Symbol VESD TJ TSTG Value +/- 17 +/- 12kV -40 to +85 -55 to +150
PRELIMINARY
Units kV
o o
C C
Electrical Characteristics (T = 25oC)
Parameter TVS Reverse Stand-Off Voltage TVS Reverse Breakdown Voltage TVS Reverse Leakage Current Series Resistors DAT Pull Up Resistor 1 DAT Pull Up Resistor 2 Total Capacitance
S ymbol VRWM VBR IR R Rup1 Rup2 Cin
Conditions
Minimum
Typical
Maximum 5
Units V V A Ohms k Ohms k Ohms pF
It = 1mA VRWM = 3.0V Each Line
6
8
10 0.5
38 12 42
45 15 50 12
52 17 58 15
Input to Gnd, Each Line VR = 2.5V, f = 1MHz
10
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ECLAMP2410P
PROTECTION PRODUCTS Typical Characteristics
Typical Insertion Loss S21 (Each Line)
CH1 S21 LOG 6 dB /REF 0 dB 1: -6.145 dB 300 MHz 0 dB -6 dB
1
PRELIMINARY
ESD Clamping (+8kV Contact)
2: -14.437 dB 900 MHz 3: -23.847 dB 1.8 GHz
2
-12 dB -18 dB -24 dB
3
4: -32.024 dB 2.5 GHz
4
-30 dB -36 dB -42 dB -48 dB 1 MHz . START030MHz 10 MHz 100 MHz
3 1 GHz GHz . 000 STOP3000000 MHz
Normalized Capacitance vs. Reverse Voltage
1.2
f = 1 MHz
50 49
Series Resistance (Ohm)
Series Resistance vs. Temperature
1
CJ(VR) / CJ(VR=2.5)
48 47 46 45 44 43 42 41
0.8 0.6 0.4 0.2 0 0 1 2 3 Reverse Voltage - VR (V) 4 5
40 -40 -25 -10 5 20 35 0 Temperature ( C) 50 65 80
Pull Up Resistance (Rup1) vs. Temperature
16200
Pull Up Resistance (Rup2) vs. Temperature
58000 57000
Pull Up Resistance (Ohm)
16100
Pull Up Resistance (Ohm)
16000 15900 15800 15700 15600 15500 15400 15300 15200 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80
56000 55000 54000 53000 52000 51000 50000 49000 48000 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temperature ( C)
o
Temperature ( C)
o
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ECLAMP2410P
PROTECTION PRODUCTS Applications Information
Device Connection The ECLAMP2410P is a microSD/T-Flash interface device designed for use in cell phones and other portable electronic devices. The ECLAMP2410P is comprised of series and pull up resistors required on the microSD interface. Each line also includes TVS diodes for ESD protection. The device may be configured for SD or SPI mode operation. In SD mode for example, the 15k Ohm pull up resistors (Rup 1 and Rup 3) are connected to VDD. In SPI mode pin 4 is not connected (Rup 1) since these are reserved lines. The 50k Ohm pull up resistor is used for card detection or SPI mode selection during power up and is disconnected by the user during regular data transfer. The ECLAMP2410P is in a 16-pin SLP package. Electrical connection is made to the 16 pins located at the bottom of the device. The device has a flow through design for easy layout. Pin connections are noted in Figure 1. A center tab serves as the ground connection. Recommendations for the ground connection are given below. Ground Connection Recommendation Parasitic inductance present in the board layout will affect the filtering and ESD performance of the device. Ground loop inductance can be reduced by using multiple vias to make the connection to the ground plane. Figure 2 shows the recommended device layout. The ground pad vias have a diameter of 0.008 inches (0.20 mm) while the two external vias have a diameter of 0.010 inches (0.250mm). The internal vias are spaced approximately evenly from the center of the pad. The designer may choose to use more vias with a smaller diameter (such as 0.005 inches or 0.125mm) since changing the diameter of the via will result in little change in inductance. Layout Guidelines for Optimum ESD Protection Good circuit board layout is critical not only for signal integrity, but also for effective suppression of ESD induced transients. For optimum ESD protection, the following guidelines are recommended: Place the device as close to the connector as possible. This practice restricts ESD coupling into adjacent traces and reduces parasitic inductance. The ESD transient return path to ground should be kept as short as possible. Whenever possible, use multiple micro vias connected directly from the device ground pad to the ground plane. Avoid running critical signals near board edges.
2006 Semtech Corp. 5 www.semtech.com
PRELIMINARY
Figure 1 - Pin Identification and Configuration (Top Side View)
D AT1 In D AT0 In C L K In R up1 Vd d C MD In D AT3 In D AT2 In
1
16
D AT1 O u t D AT0 O u t C LK Out R up3 R up2 C MD O u t D AT3 O u t D AT2 O u t
Figure 2 - Recommended Layout using Ground Vias
ECLAMP2410P
PROTECTION PRODUCTS Applications Information PRELIMINARY
DAT 1 IN
DAT 1 OUT DAT 0 OUT CLK OUT Rup 15K Rup 50K CMD OUT DAT 3 OUT DAT 2 OUT
MicroSD Connector
DAT 0 IN CLK IN Rup 15K VDD CMD IN DAT 3 IN DAT 2 IN
Host IC
ECLAMP2410P
Figure 3 - MicroSD Protection
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ECLAMP2410P
PROTECTION PRODUCTS Applications Information - Spice Model
Pin 4, 13 Rup 15K Pin 1, 8, 2, 6 R1 45 Ohms Pin 9, 16, 11, 15
Pin 7 R1 45 Ohms Pin 12
PRELIMINARY
Rup 50K Pin 10
DAT1, DAT2, DAT0, CMD
Pin 3 R1 45 Ohms Pin 14
DAT3
Pin 5
CLK
Spice Model
ECLAMP2410P Spice Parameters Parameter IS BV VJ RS IBV CJO TT M N EG
2006 Semtech Corp.
VDD
Unit Amp Volt Volt Ohm Amp Farad sec --eV
7
D1 (TVS) 2E-15 7.46 0.777 1.00 1E-3 10E-12 2.541E-9 0.246 1.1 1.11
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ECLAMP2410P
PROTECTION PRODUCTS Outline Drawing - SLP4016P16 PRELIMINARY
A
D
B
DIM
PIN 1 INDICATOR (LASER MARK) E
A aaa C A2 D1 12 LxN E1 N e D/2 E/2 A1 C
SEATING PLANE
A A1 A2 b D D1 E E1 e L N aaa bbb
DIMENSIONS INCHES MILLIMETERS MIN NOM MAX MIN NOM MAX .020 .023 .026 0.50 0.58 0.65 .000 .001 .002 0.00 .003 0.05 (0. 13) (. 005) .007 .010 .012 0.20 0.25 0.30 .153 .157 .161 3.90 4.00 4.10 .122 .126 .130 3.10 3.20 3.30 .059 .063 .067 1.50 1.60 1.70 .010 .016 .020 0.25 0.40 0.50 .020 BSC 0.50 BSC .011 .013 .015 0.28 0.33 0.38 16 16 .003 0.08 .004 0.10
bxN bbb CAB
NOT ES: 1. CO NTRO LLING DI MENSIO NS ARE I N MILLI METERS (ANG LES IN DEG REES).
2. CO PLANARIT Y APPLIES T O T HE EXPO SED PAD AS W ELL AS T HE TERM INALS.
Land Pattern - SLP4016P16
P X
DIM B C F G P X Y Z DIMENSIONS INCHES MILLIMETERS .130 3.30 .060 1.52 .018 0.45 .035 0.89 .020 0.50 .012 0.30 .025 0.63 .085 2.15
Z
G
F
(C)
Y
B
NOTES:
1. T HI S LAND PAT TERN IS F O R REF ERENCE PURPO SES O NLY. CO NSULT YO UR M ANUFACTURING G RO UP T O ENSURE YO UR CO MPANY'S M ANUFACTURING G UIDELINES ARE MET.
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ECLAMP2410P
PROTECTION PRODUCTS Marking PRELIMINARY Ordering Information
Part Number Qty per Reel 3,000 Reel Size 7 inch ECLAMP2410P.TCT
PIN 1 IND IC ATOR (LASER MAR K)
2410P YW
EMIClamp and EClamp are marks of Semtech Corporation
Tape and Reel Specification
Pin 1 Location
User Direction of feed
Device Orientation in Tape
A0 1.78 +/-0.10 mm B0 4.30 +/-0.10 mm K0 0.74 +/-0.10 mm
Tape Width
B, (Max)
D 1.5 + 0.1 mm - 0.0 mm (0.59 +.005 - .000)
D1
E 1.750.10 mm (.069.004)
F
K (MAX)
P 4.00.1 mm (.157.004)
P0 4.00.1 mm (.157.004)
P2
T(MAX)
W 12.0 mm + 0.3 mm - 0.1 mm (.472.012)
12 mm
8.2 mm (.476)
1.0 mm 0.05 (.039)
5.50.05 mm (.217.002)
4.5 mm (.177)
2.00.05mm (.079.002)
0.4 mm (.016)
Contact Information
Semtech Corporation Protection Products Division 200 Flynn Rd., Camarillo, CA 93012 Phone: (805)498-2111 FAX (805)498-3804
2006 Semtech Corp. 9 www.semtech.com

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